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公司名称:江苏天瑞仪器股份有限公司

联系人:李经理

电话:0512-50355617

手机:18550150083

传真:0512-50355809

邮件:591772571@qq.com

地址:江苏昆山市玉山镇中华园西路1888号/深圳市宝安区松岗街道琦丰达大厦22AB楼

会员站:http://www.rohs-yiqi.com

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做不到ROHS指令要求的豁免项

发布时间:2018-03-07浏览次数:955返回列表

做不到ROHS指令要求的豁免项


豁免项

简述
由于技术问题,部分材料或者产品的制造技术还做不到ROHS指令要求,在经过向欧盟的特殊申请后,以下项目可以获得豁免(部分豁免是有期限的):
RoHS ExemptionsEU RoHS
Items Exemption Clauses
原有
1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2 Mercury in straight fluorescent lamps for general purposes not exceeding:
- halophosphate 10 mg
- triphosphate with normal lifetime 5 mg
- triphosphate with long lifetime 8 mg.
3 Mercury in straight fluorescent lamps for special purposes.
4 Mercury in other lamps not specifically mentioned in this Annex.
5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6 Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
7 - lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations
9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
10 Lead used in compliant pin connector systems
11 Lead as a coating material for the thermal conduction module c-ring
12 Lead and cadmium in optical and filter glass
13 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages

15 DecaBDE in polymeric app